Silicon Carbide (SiC) is a wide band gap semiconductor that can operate at higher temperature, power level, and voltage. This enables improved energy efficiency in power devices, LED lighting, and telecommunications. Because of its unique properties, SiC is the material of choice for diverse applications such as Hybrid Electric vehicles, power electronic switches, and LED lighting technology.
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Highlights
The global RF Front-end Devices market is projected to reach US$ million by 2028 from an estimated US$ million in 2022, at a CAGR of % during 2024 and 2029.
Global key players of RF Front-end Device include Murata Manufacturing Co., Ltd, Broadcom Inc, Qualcomm, Qorvo, Skyworks Solutions Inc, NXP, TDK and Texas Instruments, etc. Top five players occupy for a share about 66%. China is th

Highlights
The global Car Key Chips market is projected to reach US$ million by 2028 from an estimated US$ million in 2022, at a CAGR of % during 2024 and 2029.
Global key players of Car Key Chips include NXP Semiconductors, Texas Instruments, Microchip and STMicroelectronics, etc. Top three players occupy for a share about 86%. China is the largest market, with a share about 30%, followed by Eur

EUV mask blanks are a low-thermal expansion glass substrate with various kinds of optical coating films on its surface. The EUV mask blank consists of 40 to 50 or more alternating layers of silicon and molybdenum on the substrate.
Highlights
The global EUV Mask Blanks market is projected to reach US$ million by 2028 from an estimated US$ million in 2022, at a CAGR of % during 2024 and 2029.
Globa

Integrated passive device (IPD) technology significantly reduces these losses by embedding capacitors, inductors, filters, baluns, and combiners into a single monolithic device leading to an electronic device with reduced footprint, reduced energy consumption, and improved RF performance.
RF Integrated Passive Devices are used in wireless applications such as Bluetooth, Wireless Local Area Network

EEE includes a wide range of products with circuity or electrical components with a power or battery supply. Almost any household or business use products like basic kitchen appliances, toys, tools to music, and ICT items, such as mobile phones, laptops, etc. EEE becomes e-waste once it has been discarded by its owner as waste without the intent of reuse. Each product has different material conten

Highlights
The global Optical Plastic Lens market is projected to reach US$ million by 2028 from an estimated US$ million in 2022, at a CAGR of % during 2024 and 2029.
At the regional level, the Chinese market has changed rapidly in the past few years, accounting for about 71 percent of the global market.
From the perspective of product market application, due to the large demand for mobile phone

In the soldering process of electronic products, rosin resin flux mainly composed of rosin, resin, halide-containing activator, additive and organic solvent is generally used. Chemical substances that can help and promote the welding process in the welding process, while having a protective effect and preventing oxidation reactions. Mainly include “auxiliary heat conduction”, “remove oxides”, “red

Highlights
The global Through Glass Vias(TGV) Substrate market is projected to reach US$ million by 2028 from an estimated US$ million in 2022, at a CAGR of % during 2024 and 2029.
At the regional level, the Chinese market has changed rapidly in the past few years, accounting for about 6% of the global market.
In terms of product type and technology, 300 mm wafers have the largest market share, a

Surface Cleaning Using Plasma in a Low Pressure Environment (vacuum) is an economical way to clean specimens uniformly and securely. Removal of contaminants from the studied substrates without affecting the overall properties of the material is one of the benefits of plasma surface cleaning method. Plasma is widely used in circuit industry, including cleaning the PCB board before coating and clean

Epitaxy refers to the deposition of an overlayer on a crystalline substrate, where the overlayer is in registry with the substrate. The overlayer is called an epitaxial film or epitaxial layer. For most technological applications, it is desired that the deposited material form a crystalline overlayer that has one well-defined orientation with respect to the substrate crystal structure (single-doma

Common Mode Choke Coils, as the name implies, are designed to attenuate and filter common mode noise within an electric system. It’s a passive device consisting of two wire coils wound on a magnetic core that block (choke) signals common to both lines in the device while being a low impedance to signals that are unique to one line or the other in the device. Common mode relates to both wires bei

The Remote Plasma Source (Remote Plasma Generator) to improve the productivity of semiconductor and LCD manufacturing is a product generating high-density plasma that supplies F (fluorine) radicals to clean chemically the Si (silicone) accumulated in the chamber after the deposition process in a semiconductor and LCD manufacturing process.
Highlights
The global Remote Plasma Sources market is pro

Film capacitors are also called Plastic Film capacitors.
The plastic film is used as the dielectric.
Thin film capacitors are capacitors with metal foil as electrode and plastic film such as polyethyl ester, polypropylene, polystyrene or polycarbonate, which are overlapped from two ends and wound into a cylindrical structure.
And according to the type of plastic film is respectively called polyeth

As the substrate material in the manufacture of printed circuit boards, copper clad laminates mainly play the role of interconnection, insulation and support for the printed circuit board, and have a great impact on the transmission speed, energy loss and characteristic impedance of the signal in the circuit. Therefore, the performance, quality, processability, manufacturing level, manufacturing c

A microcontroller (MCU for microcontroller unit) is a small computer on a single metal-oxide-semiconductor (MOS) integrated circuit chip. In modern terminology, it is similar to, but less sophisticated than, a system on a chip (SoC); a SoC may include a microcontroller as one of its components. A microcontroller contains one or more CPUs (processor cores) along with memory and programmable input/o

Highlights
The global TVS and ESD Protection Diodes market is projected to reach US$ million by 2028 from an estimated US$ million in 2022, at a CAGR of % during 2024 and 2029.
Global TVS and ESD Protection diodes main players include Infineon, Nexperia, SEMTECH, Vishay, Littelfuse, BrightKing, Amazing, STMicroelectronics, etc., totally accounting for about 68%. North America is the largest marke

Highlights
The global IGBT and MOSFET market is projected to reach US$ million by 2029 from an estimated US$ million in 2023, at a CAGR of % during 2024 and 2029.
Global IGBT and MOSFET main players include Infineon Technologies, ON Semiconductor, Toshiba, STMicroelectronics, Renesas Electronics, etc., totally accounting for about 55%. Asia-Pacific is the largest market, with a share over 57%. As

Lead-free copper clad laminate is a basic material in the electronics industry and an important raw material for the manufacture of printed circuit boards (PCB). It is widely used in electronic products, including televisions, radios, computers and mobile communications.
Highlights
The global Lead Free CCL market is projected to reach US$ million by 2028 from an estimated US$ million in 2022, at

DSP Chips to digital signal processing technology, DSP Chips refers to the chip that can realize digital signal processing technology. DSP Chips is a fast and powerful microprocessor, which is unique in that it can process data instantly. In the DSP Chips, the program and data are separated by harvard structure, with special hardware multiplier, which can be used to quickly implement various digit