Alumina DBC (Direct Bond Copper Substrate) Industry Research Report 2023
Report ID
38671
Publisher
Published Date
08-Aug
Delivery Format
PDF
No of Report Page
93
Editor's Rating
US $2,950.00
US $4,425.00
US $5,900.00
  • Report Details 
    This report aims to provide a comprehensive presentation of the global market for Alumina DBC (Direct Bond Copper Substrate), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Alumina DBC (Direct Bond Copper Substrate).
The Alumina DBC (Direct Bond Copper Substrate) market size, estimations, and forecasts are provided in terms of output/shipments (K Sq.m) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Alumina DBC (Direct Bond Copper Substrate) market comprehensively. Regional market sizes, concerning products by types, by application, and by players, are also provided. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Alumina DBC (Direct Bond Copper Substrate) manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, product type, application, and regions.
Key Companies & Market Share Insights
In this section, the readers will gain an understanding of the key players competing. This report has studied the key growth strategies, such as innovative trends and developments, intensification of product portfolio, mergers and acquisitions, collaborations, new product innovation, and geographical expansion, undertaken by these participants to maintain their presence. Apart from business strategies, the study includes current developments and key financials. The readers will also get access to the data related to global revenue, price, and sales by manufacturers for the period 2018-2023. This all-inclusive report will certainly serve the clients to stay updated and make effective decisions in their businesses. Some of the prominent players reviewed in the research report include:
    Rogers/Curamik
    KCC
    Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics)
    Heraeus Electronics
    Nanjing Zhongjiang New Material Science & Technology
    NGK Electronics Devices
    IXYS (Germany Division)
    Remtec
    Stellar Industries Corp
    Tong Hsing (acquired HCS)
    Zibo Linzi Yinhe High-Tech Development
Product Type Insights
Global markets are presented by Alumina DBC (Direct Bond Copper Substrate) type, along with growth forecasts through 2029. Estimates on production and value are based on the price in the supply chain at which the Alumina DBC (Direct Bond Copper Substrate) are procured by the manufacturers.
This report has studied every segment and provided the market size using historical data. They have also talked about the growth opportunities that the segment may pose in the future. This study bestows production and revenue data by type, and during the historical period (2018-2023) and forecast period (2024-2029).
Alumina DBC (Direct Bond Copper Substrate) segment by Type
    Alumina 96%
    Others
Application Insights
This report has provided the market size (production and revenue data) by application, during the historical period (2018-2023) and forecast period (2024-2029).
This report also outlines the market trends of each segment and consumer behaviors impacting the Alumina DBC (Direct Bond Copper Substrate) market and what implications these may have on the industry's future. This report can help to understand the relevant market and consumer trends that are driving the Alumina DBC (Direct Bond Copper Substrate) market.
Alumina DBC (Direct Bond Copper Substrate) segment by Application
    Power Electronics
    Automotive Electronics
    Home Appliances and CPV
    Aerospace and Others
Regional Outlook
This section of the report provides key insights regarding various regions and the key players operating in each region. Economic, social, environmental, technological, and political factors have been taken into consideration while assessing the growth of the particular region/country. The readers will also get their hands on the revenue and sales data of each region and country for the period 2018-2029.
The market has been segmented into various major geographies, including North America, Europe, Asia-Pacific, South America. Detailed analysis of major countries such as the USA, Germany, the U.K., Italy, France, China, Japan, South Korea, Southeast Asia, and India will be covered within the regional segment. For market estimates, data are going to be provided for 2022 because of the base year, with estimates for 2023 and forecast value for 2029.
    North America
        United States
        Canada
    Europe
        Germany
        France
        U.K.
        Italy
        Russia
    Asia-Pacific
        China
        Japan
        South Korea
        India
        Australia
        China Taiwan
        Indonesia
        Thailand
        Malaysia
    Latin America
        Mexico
        Brazil
        Argentina
Key Drivers & Barriers
High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.
COVID-19 and Russia-Ukraine War Influence Analysis
The readers in the section will understand how the Alumina DBC (Direct Bond Copper Substrate) market scenario changed across the globe during the pandemic, post-pandemic and Russia-Ukraine War. The study is done keeping in view the changes in aspects such as demand, consumption, transportation, consumer behavior, supply chain management, export and import, and production. The industry experts have also highlighted the key factors that will help create opportunities for players and stabilize the overall industry in the years to come.
Reasons to Buy This Report
This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Alumina DBC (Direct Bond Copper Substrate) market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
This report will help stakeholders to understand the global industry status and trends of Alumina DBC (Direct Bond Copper Substrate) and provides them with information on key market drivers, restraints, challenges, and opportunities.
This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
This report stays updated with novel technology integration, features, and the latest developments in the market
This report helps stakeholders to understand the COVID-19 and Russia-Ukraine War Influence on the Alumina DBC (Direct Bond Copper Substrate) industry.
This report helps stakeholders to gain insights into which regions to target globally
This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Alumina DBC (Direct Bond Copper Substrate).
This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Core Chapters
Chapter 1: Research objectives, research methods, data sources, data cross-validation;
Chapter 2: Introduces the report scope of the report, executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on.  It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 3: Detailed analysis of Alumina DBC (Direct Bond Copper Substrate) manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 5:  Production/output, value of Alumina DBC (Direct Bond Copper Substrate) by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 6:  Consumption of Alumina DBC (Direct Bond Copper Substrate) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development,  future development prospects, market space, and production of each country in the world.
Chapter 7: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 8: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 9: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 10: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market,  the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 11: The main points and conclusions of the report.
  • Table Of Content 
    1 Preface
    1.1 Scope of Report
    1.2 Reasons for Doing This Study
    1.3 Research Methodology
    1.4 Research Process
    1.5 Data Source
        1.5.1 Secondary Sources
        1.5.2 Primary Sources
2 Market Overview
    2.1 Product Definition
    2.2 Alumina DBC (Direct Bond Copper Substrate)  by Type
        2.2.1 Market Value Comparison by Type  (2018 VS 2022 VS 2029) & (US$ Million)
        1.2.2 Alumina 96%
        1.2.3 Others
    2.3 Alumina DBC (Direct Bond Copper Substrate)  by Application
        2.3.1 Market Value Comparison by Application (2018 VS 2022 VS 2029) & (US$ Million)
        2.3.2 Power Electronics
        2.3.3 Automotive Electronics
        2.3.4 Home Appliances and CPV
        2.3.5 Aerospace and Others
    2.4 Global Market Growth Prospects
        2.4.1 Global Alumina DBC (Direct Bond Copper Substrate) Production Value Estimates and Forecasts (2018-2029)
        2.4.2 Global Alumina DBC (Direct Bond Copper Substrate) Production Capacity Estimates and Forecasts (2018-2029)
        2.4.3 Global Alumina DBC (Direct Bond Copper Substrate) Production Estimates and Forecasts (2018-2029)
        2.4.4 Global Alumina DBC (Direct Bond Copper Substrate) Market Average Price (2018-2029)
3 Market Competitive Landscape by Manufacturers
    3.1 Global Alumina DBC (Direct Bond Copper Substrate) Production by Manufacturers (2018-2023)
    3.2 Global Alumina DBC (Direct Bond Copper Substrate) Production Value by Manufacturers (2018-2023)
    3.3 Global Alumina DBC (Direct Bond Copper Substrate) Average Price by Manufacturers (2018-2023)
    3.4 Global Alumina DBC (Direct Bond Copper Substrate) Industry Manufacturers Ranking, 2021 VS 2022 VS 2023
    3.5 Global Alumina DBC (Direct Bond Copper Substrate) Key Manufacturers, Manufacturing Sites & Headquarters
    3.6 Global Alumina DBC (Direct Bond Copper Substrate) Manufacturers, Product Type & Application
    3.7 Global Alumina DBC (Direct Bond Copper Substrate) Manufacturers, Date of Enter into This Industry
    3.8 Global Alumina DBC (Direct Bond Copper Substrate) Market CR5 and HHI
    3.9 Global Manufacturers Mergers & Acquisition
4 Manufacturers Profiled
    4.1 Rogers/Curamik
        4.1.1 Rogers/Curamik Alumina DBC (Direct Bond Copper Substrate) Company Information
        4.1.2 Rogers/Curamik Alumina DBC (Direct Bond Copper Substrate) Business Overview
        4.1.3 Rogers/Curamik Alumina DBC (Direct Bond Copper Substrate) Production, Value and Gross Margin (2018-2023)
        4.1.4 Rogers/Curamik Product Portfolio
        4.1.5 Rogers/Curamik Recent Developments
    4.2 KCC
        4.2.1 KCC Alumina DBC (Direct Bond Copper Substrate) Company Information
        4.2.2 KCC Alumina DBC (Direct Bond Copper Substrate) Business Overview
        4.2.3 KCC Alumina DBC (Direct Bond Copper Substrate) Production, Value and Gross Margin (2018-2023)
        4.2.4 KCC Product Portfolio
        4.2.5 KCC Recent Developments
    4.3 Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics)
        4.3.1 Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics) Alumina DBC (Direct Bond Copper Substrate) Company Information
        4.3.2 Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics) Alumina DBC (Direct Bond Copper Substrate) Business Overview
        4.3.3 Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics) Alumina DBC (Direct Bond Copper Substrate) Production, Value and Gross Margin (2018-2023)
        4.3.4 Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics) Product Portfolio
        4.3.5 Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics) Recent Developments
    4.4 Heraeus Electronics
        4.4.1 Heraeus Electronics Alumina DBC (Direct Bond Copper Substrate) Company Information
        4.4.2 Heraeus Electronics Alumina DBC (Direct Bond Copper Substrate) Business Overview
        4.4.3 Heraeus Electronics Alumina DBC (Direct Bond Copper Substrate) Production, Value and Gross Margin (2018-2023)
        4.4.4 Heraeus Electronics Product Portfolio
        4.4.5 Heraeus Electronics Recent Developments
    4.5 Nanjing Zhongjiang New Material Science & Technology
        4.5.1 Nanjing Zhongjiang New Material Science & Technology Alumina DBC (Direct Bond Copper Substrate) Company Information
        4.5.2 Nanjing Zhongjiang New Material Science & Technology Alumina DBC (Direct Bond Copper Substrate) Business Overview
        4.5.3 Nanjing Zhongjiang New Material Science & Technology Alumina DBC (Direct Bond Copper Substrate) Production, Value and Gross Margin (2018-2023)
        4.5.4 Nanjing Zhongjiang New Material Science & Technology Product Portfolio
        4.5.5 Nanjing Zhongjiang New Material Science & Technology Recent Developments
    4.6 NGK Electronics Devices
        4.6.1 NGK Electronics Devices Alumina DBC (Direct Bond Copper Substrate) Company Information
        4.6.2 NGK Electronics Devices Alumina DBC (Direct Bond Copper Substrate) Business Overview
        4.6.3 NGK Electronics Devices Alumina DBC (Direct Bond Copper Substrate) Production, Value and Gross Margin (2018-2023)
        4.6.4 NGK Electronics Devices Product Portfolio
        4.6.5 NGK Electronics Devices Recent Developments
    4.7 IXYS (Germany Division)
        4.7.1 IXYS (Germany Division) Alumina DBC (Direct Bond Copper Substrate) Company Information
        4.7.2 IXYS (Germany Division) Alumina DBC (Direct Bond Copper Substrate) Business Overview
        4.7.3 IXYS (Germany Division) Alumina DBC (Direct Bond Copper Substrate) Production, Value and Gross Margin (2018-2023)
        4.7.4 IXYS (Germany Division) Product Portfolio
        4.7.5 IXYS (Germany Division) Recent Developments
    4.8 Remtec
        4.8.1 Remtec Alumina DBC (Direct Bond Copper Substrate) Company Information
        4.8.2 Remtec Alumina DBC (Direct Bond Copper Substrate) Business Overview
        4.8.3 Remtec Alumina DBC (Direct Bond Copper Substrate) Production, Value and Gross Margin (2018-2023)
        4.8.4 Remtec Product Portfolio
        4.8.5 Remtec Recent Developments
    4.9 Stellar Industries Corp
        4.9.1 Stellar Industries Corp Alumina DBC (Direct Bond Copper Substrate) Company Information
        4.9.2 Stellar Industries Corp Alumina DBC (Direct Bond Copper Substrate) Business Overview
        4.9.3 Stellar Industries Corp Alumina DBC (Direct Bond Copper Substrate) Production, Value and Gross Margin (2018-2023)
        4.9.4 Stellar Industries Corp Product Portfolio
        4.9.5 Stellar Industries Corp Recent Developments
    4.10 Tong Hsing (acquired HCS)
        4.10.1 Tong Hsing (acquired HCS) Alumina DBC (Direct Bond Copper Substrate) Company Information
        4.10.2 Tong Hsing (acquired HCS) Alumina DBC (Direct Bond Copper Substrate) Business Overview
        4.10.3 Tong Hsing (acquired HCS) Alumina DBC (Direct Bond Copper Substrate) Production, Value and Gross Margin (2018-2023)
        4.10.4 Tong Hsing (acquired HCS) Product Portfolio
        4.10.5 Tong Hsing (acquired HCS) Recent Developments
    7.11 Zibo Linzi Yinhe High-Tech Development
        7.11.1 Zibo Linzi Yinhe High-Tech Development Alumina DBC (Direct Bond Copper Substrate) Company Information
        7.11.2 Zibo Linzi Yinhe High-Tech Development Alumina DBC (Direct Bond Copper Substrate) Business Overview
        4.11.3 Zibo Linzi Yinhe High-Tech Development Alumina DBC (Direct Bond Copper Substrate) Production, Value and Gross Margin (2018-2023)
        7.11.4 Zibo Linzi Yinhe High-Tech Development Product Portfolio
        7.11.5 Zibo Linzi Yinhe High-Tech Development Recent Developments
5 Global Alumina DBC (Direct Bond Copper Substrate) Production by Region
    5.1 Global Alumina DBC (Direct Bond Copper Substrate) Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
    5.2 Global Alumina DBC (Direct Bond Copper Substrate) Production by Region: 2018-2029
        5.2.1 Global Alumina DBC (Direct Bond Copper Substrate) Production by Region: 2018-2023
        5.2.2 Global Alumina DBC (Direct Bond Copper Substrate) Production Forecast by Region (2024-2029)
    5.3 Global Alumina DBC (Direct Bond Copper Substrate) Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
    5.4 Global Alumina DBC (Direct Bond Copper Substrate) Production Value by Region: 2018-2029
        5.4.1 Global Alumina DBC (Direct Bond Copper Substrate) Production Value by Region: 2018-2023
        5.4.2 Global Alumina DBC (Direct Bond Copper Substrate) Production Value Forecast by Region (2024-2029)
    5.5 Global Alumina DBC (Direct Bond Copper Substrate) Market Price Analysis by Region (2018-2023)
    5.6 Global Alumina DBC (Direct Bond Copper Substrate) Production and Value, YOY Growth
        5.6.1 North America Alumina DBC (Direct Bond Copper Substrate) Production Value Estimates and Forecasts (2018-2029)
        5.6.2 Europe Alumina DBC (Direct Bond Copper Substrate) Production Value Estimates and Forecasts (2018-2029)
        5.6.3 China Alumina DBC (Direct Bond Copper Substrate) Production Value Estimates and Forecasts (2018-2029)
        5.6.4 Japan Alumina DBC (Direct Bond Copper Substrate) Production Value Estimates and Forecasts (2018-2029)
        5.6.5 South Korea Alumina DBC (Direct Bond Copper Substrate) Production Value Estimates and Forecasts (2018-2029)
6 Global Alumina DBC (Direct Bond Copper Substrate) Consumption by Region
    6.1 Global Alumina DBC (Direct Bond Copper Substrate) Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
    6.2 Global Alumina DBC (Direct Bond Copper Substrate) Consumption by Region (2018-2029)
        6.2.1 Global Alumina DBC (Direct Bond Copper Substrate) Consumption by Region: 2018-2029
        6.2.2 Global Alumina DBC (Direct Bond Copper Substrate) Forecasted Consumption by Region (2024-2029)
    6.3 North America
        6.3.1 North America Alumina DBC (Direct Bond Copper Substrate) Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
        6.3.2 North America Alumina DBC (Direct Bond Copper Substrate) Consumption by Country (2018-2029)
        6.3.3 United States
        6.3.4 Canada
    6.4 Europe
        6.4.1 Europe Alumina DBC (Direct Bond Copper Substrate) Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
        6.4.2 Europe Alumina DBC (Direct Bond Copper Substrate) Consumption by Country (2018-2029)
        6.4.3 Germany
        6.4.4 France
        6.4.5 U.K.
        6.4.6 Italy
        6.4.7 Russia
    6.5 Asia Pacific
        6.5.1 Asia Pacific Alumina DBC (Direct Bond Copper Substrate) Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
        6.5.2 Asia Pacific Alumina DBC (Direct Bond Copper Substrate) Consumption by Country (2018-2029)
        6.5.3 China
        6.5.4 Japan
        6.5.5 South Korea
        6.5.6 China Taiwan
        6.5.7 Southeast Asia
        6.5.8 India
        6.5.9 Australia
    6.6 Latin America, Middle East & Africa
        6.6.1 Latin America, Middle East & Africa Alumina DBC (Direct Bond Copper Substrate) Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
        6.6.2 Latin America, Middle East & Africa Alumina DBC (Direct Bond Copper Substrate) Consumption by Country (2018-2029)
        6.6.3 Mexico
        6.6.4 Brazil
        6.6.5 Turkey
        6.6.5 GCC Countries
7 Segment by Type
    7.1 Global Alumina DBC (Direct Bond Copper Substrate) Production by Type (2018-2029)
        7.1.1 Global Alumina DBC (Direct Bond Copper Substrate) Production by Type (2018-2029) & (K Sq.m)
        7.1.2 Global Alumina DBC (Direct Bond Copper Substrate) Production Market Share by Type (2018-2029)
    7.2 Global Alumina DBC (Direct Bond Copper Substrate) Production Value by Type (2018-2029)
        7.2.1 Global Alumina DBC (Direct Bond Copper Substrate) Production Value by Type (2018-2029) & (US$ Million)
        7.2.2 Global Alumina DBC (Direct Bond Copper Substrate) Production Value Market Share by Type (2018-2029)
    7.3 Global Alumina DBC (Direct Bond Copper Substrate) Price by Type (2018-2029)
8 Segment by Application
    8.1 Global Alumina DBC (Direct Bond Copper Substrate) Production by Application (2018-2029)
        8.1.1 Global Alumina DBC (Direct Bond Copper Substrate) Production by Application (2018-2029) & (K Sq.m)
        8.1.2 Global Alumina DBC (Direct Bond Copper Substrate) Production by Application (2018-2029) & (K Sq.m)
    8.2 Global Alumina DBC (Direct Bond Copper Substrate) Production Value by Application (2018-2029)
        8.2.1 Global Alumina DBC (Direct Bond Copper Substrate) Production Value by Application (2018-2029) & (US$ Million)
        8.2.2 Global Alumina DBC (Direct Bond Copper Substrate) Production Value Market Share by Application (2018-2029)
    8.3 Global Alumina DBC (Direct Bond Copper Substrate) Price by Application (2018-2029)
9 Value Chain and Sales Channels Analysis of the Market
    9.1 Alumina DBC (Direct Bond Copper Substrate) Value Chain Analysis
        9.1.1 Alumina DBC (Direct Bond Copper Substrate) Key Raw Materials
        9.1.2 Raw Materials Key Suppliers
        9.1.3 Alumina DBC (Direct Bond Copper Substrate) Production Mode & Process
    9.2 Alumina DBC (Direct Bond Copper Substrate) Sales Channels Analysis
        9.2.1 Direct Comparison with Distribution Share
        9.2.2 Alumina DBC (Direct Bond Copper Substrate) Distributors
        9.2.3 Alumina DBC (Direct Bond Copper Substrate) Customers
10 Global Alumina DBC (Direct Bond Copper Substrate) Analyzing Market Dynamics
    10.1 Alumina DBC (Direct Bond Copper Substrate) Industry Trends
    10.2 Alumina DBC (Direct Bond Copper Substrate) Industry Drivers
    10.3 Alumina DBC (Direct Bond Copper Substrate) Industry Opportunities and Challenges
    10.4 Alumina DBC (Direct Bond Copper Substrate) Industry Restraints
11 Report Conclusion
12 Disclaimer
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