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Wafer Dicing Tape Market, Global Outlook and Forecast 2024-2030
Report ID
49430
Publisher
Market Monitor Global
Published Date
07-Feb
Delivery Format
PDF
No of Report Page
124
Editor's Rating
-
Report Details
This research report provides a comprehensive analysis of the Wafer Dicing Tape market, focusing on the current trends, market dynamics, and future prospects. The report explores the global Wafer Dicing Tape market, including major regions such as North America, Europe, Asia-Pacific, and emerging markets. It also examines key factors driving the growth of Wafer Dicing Tape, challenges faced by the industry, and potential opportunities for market players. The global Wafer Dicing Tape market has witnessed rapid growth in recent years, driven by increasing environmental concerns, government incentives, and advancements in technology. The Wafer Dicing Tape market presents opportunities for various stakeholders, including Die to Substrate, Die to Die. Collaboration between the private sector and governments can accelerate the development of supportive policies, research and development efforts, and investment in Wafer Dicing Tape market. Additionally, the growing consumer demand present avenues for market expansion. The global Wafer Dicing Tape market was valued at US$ million in 2023 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period. Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year. Key Features: The research report on the Wafer Dicing Tape market includes several key features to provide comprehensive insights and facilitate decision-making for stakeholders. Executive Summary: The report provides overview of the key findings, market trends, and major insights of the Wafer Dicing Tape market. Market Overview: The report provides a comprehensive overview of the Wafer Dicing Tape market, including its definition, historical development, and current market size. It covers market segmentation by Type (e.g., Double Coated Type, Single Coated Type), region, and application, highlighting the key drivers, challenges, and opportunities within each segment. Market Dynamics: The report analyses the market dynamics driving the growth and development of the Wafer Dicing Tape market. The report includes an assessment of government policies and regulations, technological advancements, consumer trends and preferences, infrastructure development, and industry collaborations. This analysis helps stakeholders understand the factors influencing the Wafer Dicing Tape market's trajectory. Competitive Landscape: The report provides an in-depth analysis of the competitive landscape within the Wafer Dicing Tape market. It includes profiles of major market players, their market share, strategies, product portfolios, and recent developments. Market Segmentation and Forecast: The report segment the Wafer Dicing Tape market based on various parameters, such as by Type, region, and by Application. It provides market size and growth forecasts for each segment, supported by quantitative data and analysis. This helps stakeholders identify growth opportunities and make informed investment decisions. Technological Trends: The report should highlight the key technological trends shaping the Wafer Dicing Tape market, such as advancements in Type One technology and emerging substitutes. It analyses the impact of these trends on market growth, adoption rates, and consumer preferences. Market Challenges and Opportunities: The report identify and analyses the major challenges faced by the Wafer Dicing Tape market, such as technical bottleneck, cost limitations, and high entry barrier. It also highlights the opportunities for market growth, such as government incentives, emerging markets, and collaborations between stakeholders. Regulatory and Policy Analysis: The report should assess the regulatory and policy landscape for Wafer Dicing Tape, including government incentives, emission standards, and infrastructure development plans. It should analyse the impact of these policies on market growth and provide insights into future regulatory developments. Recommendations and Conclusion: The report conclude with actionable recommendations for stakeholders, such as Application One Consumer, policymakers, investors, and infrastructure providers. These recommendations should be based on the research findings and address key challenges and opportunities within the Wafer Dicing Tape market. Supporting Data and Appendices: The report include supporting data, charts, and graphs to substantiate the analysis and findings. It also includes appendices with additional detailed information, such as data sources, survey questionnaires, and detailed market forecasts. Market Segmentation Wafer Dicing Tape market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. Market segment by Type Double Coated Type Single Coated Type Market segment by Application Die to Substrate Die to Die Film on Wire Global Wafer Dicing Tape Market Segment Percentages, By Region and Country, 2023 (%) North America US Canada Mexico Europe Germany France U.K. Italy Russia Nordic Countries Benelux Rest of Europe Asia China Japan South Korea Southeast Asia India Rest of Asia South America Brazil Argentina Rest of South America Middle East & Africa Turkey Israel Saudi Arabia UAE Rest of Middle East & Africa Major players covered Nitto Lintec Corporation AI Technology Semiconductor Equipment Sumitomo Bakelite Minitron NPMT Denka Hitachi Chemical Furukawa Electric 3M Company Mitsui Chemicals Outline of Major Chapters: Chapter 1: Introduces the definition of Wafer Dicing Tape, market overview. Chapter 2: Global Wafer Dicing Tape market size in revenue and volume. Chapter 3: Detailed analysis of Wafer Dicing Tape manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc. Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments. Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets. Chapter 6: Sales of Wafer Dicing Tape in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world. Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc. Chapter 8: Global Wafer Dicing Tape capacity by region & country. Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry. Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry. Chapter 11: The main points and conclusions of the report. -
Table Of Content
1 Introduction to Research & Analysis Reports 1.1 Wafer Dicing Tape Market Definition 1.2 Market Segments 1.2.1 Market by Type 1.2.2 Market by Application 1.3 Global Wafer Dicing Tape Market Overview 1.4 Features & Benefits of This Report 1.5 Methodology & Sources of Information 1.5.1 Research Methodology 1.5.2 Research Process 1.5.3 Base Year 1.5.4 Report Assumptions & Caveats 2 Global Wafer Dicing Tape Overall Market Size 2.1 Global Wafer Dicing Tape Market Size: 2023 VS 2030 2.2 Global Wafer Dicing Tape Revenue, Prospects & Forecasts: 2019-2030 2.3 Global Wafer Dicing Tape Sales: 2019-2030 3 Company Landscape 3.1 Top Wafer Dicing Tape Players in Global Market 3.2 Top Global Wafer Dicing Tape Companies Ranked by Revenue 3.3 Global Wafer Dicing Tape Revenue by Companies 3.4 Global Wafer Dicing Tape Sales by Companies 3.5 Global Wafer Dicing Tape Price by Manufacturer (2019-2024) 3.6 Top 3 and Top 5 Wafer Dicing Tape Companies in Global Market, by Revenue in 2023 3.7 Global Manufacturers Wafer Dicing Tape Product Type 3.8 Tier 1, Tier 2 and Tier 3 Wafer Dicing Tape Players in Global Market 3.8.1 List of Global Tier 1 Wafer Dicing Tape Companies 3.8.2 List of Global Tier 2 and Tier 3 Wafer Dicing Tape Companies 4 Sights by Product 4.1 Overview 4.1.1 By Type - Global Wafer Dicing Tape Market Size Markets, 2023 & 2030 4.1.2 Double Coated Type 4.1.3 Single Coated Type 4.2 By Type - Global Wafer Dicing Tape Revenue & Forecasts 4.2.1 By Type - Global Wafer Dicing Tape Revenue, 2019-2024 4.2.2 By Type - Global Wafer Dicing Tape Revenue, 2025-2030 4.2.3 By Type - Global Wafer Dicing Tape Revenue Market Share, 2019-2030 4.3 By Type - Global Wafer Dicing Tape Sales & Forecasts 4.3.1 By Type - Global Wafer Dicing Tape Sales, 2019-2024 4.3.2 By Type - Global Wafer Dicing Tape Sales, 2025-2030 4.3.3 By Type - Global Wafer Dicing Tape Sales Market Share, 2019-2030 4.4 By Type - Global Wafer Dicing Tape Price (Manufacturers Selling Prices), 2019-2030 5 Sights by Application 5.1 Overview 5.1.1 By Application - Global Wafer Dicing Tape Market Size, 2023 & 2030 5.1.2 Die to Substrate 5.1.3 Die to Die 5.1.4 Film on Wire 5.2 By Application - Global Wafer Dicing Tape Revenue & Forecasts 5.2.1 By Application - Global Wafer Dicing Tape Revenue, 2019-2024 5.2.2 By Application - Global Wafer Dicing Tape Revenue, 2025-2030 5.2.3 By Application - Global Wafer Dicing Tape Revenue Market Share, 2019-2030 5.3 By Application - Global Wafer Dicing Tape Sales & Forecasts 5.3.1 By Application - Global Wafer Dicing Tape Sales, 2019-2024 5.3.2 By Application - Global Wafer Dicing Tape Sales, 2025-2030 5.3.3 By Application - Global Wafer Dicing Tape Sales Market Share, 2019-2030 5.4 By Application - Global Wafer Dicing Tape Price (Manufacturers Selling Prices), 2019-2030 6 Sights by Region 6.1 By Region - Global Wafer Dicing Tape Market Size, 2023 & 2030 6.2 By Region - Global Wafer Dicing Tape Revenue & Forecasts 6.2.1 By Region - Global Wafer Dicing Tape Revenue, 2019-2024 6.2.2 By Region - Global Wafer Dicing Tape Revenue, 2025-2030 6.2.3 By Region - Global Wafer Dicing Tape Revenue Market Share, 2019-2030 6.3 By Region - Global Wafer Dicing Tape Sales & Forecasts 6.3.1 By Region - Global Wafer Dicing Tape Sales, 2019-2024 6.3.2 By Region - Global Wafer Dicing Tape Sales, 2025-2030 6.3.3 By Region - Global Wafer Dicing Tape Sales Market Share, 2019-2030 6.4 North America 6.4.1 By Country - North America Wafer Dicing Tape Revenue, 2019-2030 6.4.2 By Country - North America Wafer Dicing Tape Sales, 2019-2030 6.4.3 US Wafer Dicing Tape Market Size, 2019-2030 6.4.4 Canada Wafer Dicing Tape Market Size, 2019-2030 6.4.5 Mexico Wafer Dicing Tape Market Size, 2019-2030 6.5 Europe 6.5.1 By Country - Europe Wafer Dicing Tape Revenue, 2019-2030 6.5.2 By Country - Europe Wafer Dicing Tape Sales, 2019-2030 6.5.3 Germany Wafer Dicing Tape Market Size, 2019-2030 6.5.4 France Wafer Dicing Tape Market Size, 2019-2030 6.5.5 U.K. Wafer Dicing Tape Market Size, 2019-2030 6.5.6 Italy Wafer Dicing Tape Market Size, 2019-2030 6.5.7 Russia Wafer Dicing Tape Market Size, 2019-2030 6.5.8 Nordic Countries Wafer Dicing Tape Market Size, 2019-2030 6.5.9 Benelux Wafer Dicing Tape Market Size, 2019-2030 6.6 Asia 6.6.1 By Region - Asia Wafer Dicing Tape Revenue, 2019-2030 6.6.2 By Region - Asia Wafer Dicing Tape Sales, 2019-2030 6.6.3 China Wafer Dicing Tape Market Size, 2019-2030 6.6.4 Japan Wafer Dicing Tape Market Size, 2019-2030 6.6.5 South Korea Wafer Dicing Tape Market Size, 2019-2030 6.6.6 Southeast Asia Wafer Dicing Tape Market Size, 2019-2030 6.6.7 India Wafer Dicing Tape Market Size, 2019-2030 6.7 South America 6.7.1 By Country - South America Wafer Dicing Tape Revenue, 2019-2030 6.7.2 By Country - South America Wafer Dicing Tape Sales, 2019-2030 6.7.3 Brazil Wafer Dicing Tape Market Size, 2019-2030 6.7.4 Argentina Wafer Dicing Tape Market Size, 2019-2030 6.8 Middle East & Africa 6.8.1 By Country - Middle East & Africa Wafer Dicing Tape Revenue, 2019-2030 6.8.2 By Country - Middle East & Africa Wafer Dicing Tape Sales, 2019-2030 6.8.3 Turkey Wafer Dicing Tape Market Size, 2019-2030 6.8.4 Israel Wafer Dicing Tape Market Size, 2019-2030 6.8.5 Saudi Arabia Wafer Dicing Tape Market Size, 2019-2030 6.8.6 UAE Wafer Dicing Tape Market Size, 2019-2030 7 Manufacturers & Brands Profiles 7.1 Nitto 7.1.1 Nitto Company Summary 7.1.2 Nitto Business Overview 7.1.3 Nitto Wafer Dicing Tape Major Product Offerings 7.1.4 Nitto Wafer Dicing Tape Sales and Revenue in Global (2019-2024) 7.1.5 Nitto Key News & Latest Developments 7.2 Lintec Corporation 7.2.1 Lintec Corporation Company Summary 7.2.2 Lintec Corporation Business Overview 7.2.3 Lintec Corporation Wafer Dicing Tape Major Product Offerings 7.2.4 Lintec Corporation Wafer Dicing Tape Sales and Revenue in Global (2019-2024) 7.2.5 Lintec Corporation Key News & Latest Developments 7.3 AI Technology 7.3.1 AI Technology Company Summary 7.3.2 AI Technology Business Overview 7.3.3 AI Technology Wafer Dicing Tape Major Product Offerings 7.3.4 AI Technology Wafer Dicing Tape Sales and Revenue in Global (2019-2024) 7.3.5 AI Technology Key News & Latest Developments 7.4 Semiconductor Equipment 7.4.1 Semiconductor Equipment Company Summary 7.4.2 Semiconductor Equipment Business Overview 7.4.3 Semiconductor Equipment Wafer Dicing Tape Major Product Offerings 7.4.4 Semiconductor Equipment Wafer Dicing Tape Sales and Revenue in Global (2019-2024) 7.4.5 Semiconductor Equipment Key News & Latest Developments 7.5 Sumitomo Bakelite 7.5.1 Sumitomo Bakelite Company Summary 7.5.2 Sumitomo Bakelite Business Overview 7.5.3 Sumitomo Bakelite Wafer Dicing Tape Major Product Offerings 7.5.4 Sumitomo Bakelite Wafer Dicing Tape Sales and Revenue in Global (2019-2024) 7.5.5 Sumitomo Bakelite Key News & Latest Developments 7.6 Minitron 7.6.1 Minitron Company Summary 7.6.2 Minitron Business Overview 7.6.3 Minitron Wafer Dicing Tape Major Product Offerings 7.6.4 Minitron Wafer Dicing Tape Sales and Revenue in Global (2019-2024) 7.6.5 Minitron Key News & Latest Developments 7.7 NPMT 7.7.1 NPMT Company Summary 7.7.2 NPMT Business Overview 7.7.3 NPMT Wafer Dicing Tape Major Product Offerings 7.7.4 NPMT Wafer Dicing Tape Sales and Revenue in Global (2019-2024) 7.7.5 NPMT Key News & Latest Developments 7.8 Denka 7.8.1 Denka Company Summary 7.8.2 Denka Business Overview 7.8.3 Denka Wafer Dicing Tape Major Product Offerings 7.8.4 Denka Wafer Dicing Tape Sales and Revenue in Global (2019-2024) 7.8.5 Denka Key News & Latest Developments 7.9 Hitachi Chemical 7.9.1 Hitachi Chemical Company Summary 7.9.2 Hitachi Chemical Business Overview 7.9.3 Hitachi Chemical Wafer Dicing Tape Major Product Offerings 7.9.4 Hitachi Chemical Wafer Dicing Tape Sales and Revenue in Global (2019-2024) 7.9.5 Hitachi Chemical Key News & Latest Developments 7.10 Furukawa Electric 7.10.1 Furukawa Electric Company Summary 7.10.2 Furukawa Electric Business Overview 7.10.3 Furukawa Electric Wafer Dicing Tape Major Product Offerings 7.10.4 Furukawa Electric Wafer Dicing Tape Sales and Revenue in Global (2019-2024) 7.10.5 Furukawa Electric Key News & Latest Developments 7.11 3M Company 7.11.1 3M Company Company Summary 7.11.2 3M Company Business Overview 7.11.3 3M Company Wafer Dicing Tape Major Product Offerings 7.11.4 3M Company Wafer Dicing Tape Sales and Revenue in Global (2019-2024) 7.11.5 3M Company Key News & Latest Developments 7.12 Mitsui Chemicals 7.12.1 Mitsui Chemicals Company Summary 7.12.2 Mitsui Chemicals Business Overview 7.12.3 Mitsui Chemicals Wafer Dicing Tape Major Product Offerings 7.12.4 Mitsui Chemicals Wafer Dicing Tape Sales and Revenue in Global (2019-2024) 7.12.5 Mitsui Chemicals Key News & Latest Developments 8 Global Wafer Dicing Tape Production Capacity, Analysis 8.1 Global Wafer Dicing Tape Production Capacity, 2019-2030 8.2 Wafer Dicing Tape Production Capacity of Key Manufacturers in Global Market 8.3 Global Wafer Dicing Tape Production by Region 9 Key Market Trends, Opportunity, Drivers and Restraints 9.1 Market Opportunities & Trends 9.2 Market Drivers 9.3 Market Restraints 10 Wafer Dicing Tape Supply Chain Analysis 10.1 Wafer Dicing Tape Industry Value Chain 10.2 Wafer Dicing Tape Upstream Market 10.3 Wafer Dicing Tape Downstream and Clients 10.4 Marketing Channels Analysis 10.4.1 Marketing Channels 10.4.2 Wafer Dicing Tape Distributors and Sales Agents in Global 11 Conclusion 12 Appendix 12.1 Note 12.2 Examples of Clients 12.3 Disclaimer -
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